Tao Yuan
Chair, Professor
Stocker Center 272
Center for Advanced Systems and Transportation Logistics Engineering
Industrial and Systems Engineering
Tao Yuan joined 51社区 in 2008. Yuan teaches reliability, engineering statistics, engineering probability, operations research, design of experiments and stochastic processes.
Research Interests: nanomanufacturing, advanced engineering materials, stochastic processes, bayesian statistics
All Degrees Earned: Ph.D., Industrial Engineering, University of Tennessee, 2007; M.E., Industrial Engineering, Texas A&M University, 2004; M.S., Aerospace Engineering, Texas A&M University, 2003; B.E., Thermal Engineering, Tsinghua University, 2000.
Journal Article, Academic Journal (33)
- Zhu, X., Fu, Y., Yuan, T. (2020). Optimum reassignment of degrading components for a non-repairable systems. 3. IISE Transactions; 52: 349-361. .
- Yuan, T., Bae, S., Kuo, Y. (2020). Statistical Models of Overdispersed Spatial Defects for Predicting the Yield of Integrated Circuits. 2. IEEE Transactions on Reliability; 69: 510-521.
- Chern, A., Nandwana, P., Yuan, T., Kirk, M., Dehoff, R., Liaw, P., Dutya, C. (2019). A Review on the Fatigue Behavior of Ti-6Al-4V Fabricated by Electron Beam Melting Additive Manufacturing. International Journal of Fatigue; 119: 173-184. .
- Zhu, X., Jiao, C., Yuan, T. (2019). Optimal decisions on product reliability, sales and promotion under nonrenewable warranties. 106268. Elsevier; 192: .
- Zhu, X., Wang, J., Yuan, T. (2019). Design and maintenance for the data storage system considering system rebuilding process. 106576. Elsevier; 191: .
- Fu, Y., Yuan, T., Zhu, X. (2019). Importance-measure based methods for component reassignment problem of degrading components. 106501. Elsevier; 190: .
- Yuan, T., Wu, X., Bae, S., Zhu, X. (2019). Reliability assessment of a continuous-state fuel cell stack system with multiple degrading components. Elsevier; 189: 157-164. .
- Chen, P., Lee, C., Wang, S., Seifi, M., Lewandowski, J., Dahmen, K., Jia, H., Xie, X., Chen, B., Yeh, J., Tsai, C., Yuan, T., Liaw, P. (2018). Fatigue Behavior of High-entropy Alloys: A Review. 2. Science China Technological Sciences; 81: 168-178.
- Zhu, X., Fu, Y., Yuan, T., Wu, X. (2017). Birnbaum Importance based Heuristics for Multi-type Component Assignment Problems. Reliability Engineering and System Safety; 165: 209-221.
- Yuan, T., Bae, S., Zhu, X. (2016). A Bayesian approach to degradation-based burn-in optimization for display products exhibiting two-phase degradation patterns. Reliability Engineering and System Safety; 155: 55-63.
- Kim, S., Yuan, T., Bae, S. (2016). A Spatio-Temporal Defect Process Model for Competing Progressive Breakdown Modes of Ultra-Thin Gate Oxides. 1. IEEE Transactions on Reliability; 65: 263-271.
- Bae, S., Yuan, T., Kim, S. (2016). Bayesian degradation modeling for reliability prediction of organic light-emitting diodes. Journal of Computational Science; 17: 117-125.
- Bae, S., Yuan, T., Ning, S., Kuo, W. (2015). A Bayesian Approach to Modeling Two-phase Degradation using Change-point Regression. Reliability Engineering & System Safety; 124: 66-74.
- Yuan, T., Yi, J. (2015). A Hierachial Bayesian Degradation Model for Hetergeneous Data. 1. IEEE Transactions on Reliability; 64: 63-70.
- Tang, Z., Yuan, T., Tsai, C., Yeh, J., Lundin, C., Liaw, P. (2015). Fatigue Behavior of a wrought Al0.5CoCrCuFeNi Two-Phase High-Entropy Alloy. Acta Materialia; 99: 247-258.
- Yuan, T., Liu, S., Kuo, Y. (2014). Bayesian Analysis for Accelerated Life Tests using a Dirichlet Process Weibull Mixture Model. 1. IEEE Transactions on Reliability; 63: 58-67.
- Chuang, C., Yuan, T., Dmowski, W., Wang, G., Freels, M., Liaw, P., Li, R., Zhang, T. (2013). Fatigue-induced Damage in Zr-based Bulk Metallic Glasses. 2578. Scientific Reports; 3.
- Yuan, T., Wang, G., Feng, Q., Liaw, P., Yokoyama, Y., Inoue, A. (2013). Modeling Size Effects on Fatigue Life of a Zirconium-based Bulk-Metallic Glass under Bending. Acta Meterialla; 61: 273-279.
- Cheng, N., Yuan, T. (2013). Non-parametric Bayesian Lifetime Data Analysis using Dirichlet Process Lognormal Mixture Model. 3. Naval Research Logistics; 60: 208-221.
- Hemphill, M., Yuan, T., Wang, G., Yeh, J., Tsai, C., Chuang, A., Liaw, P. (2012). Fatigue Behavior of AI0.5CoCrCuFeNi high entropy alloys. 16. Acta Materialia; 60: 5723-5734.
- Yang, C., Kuo, Y., Yuan, T. (2012). Memory Functions of molybdenum oxide nanodots-embedded ZrHfo high k. 6. ElectroChemical and Solid-State Letters; 15: 192-194.
- Yang, C., Yuan, T., Kuo, W., Kuo, Y. (2012). Non-parametric Bayesian modeling of hazard rate with a change point for nanoelectronic devices. 7. IIE Transactions; 44: 496-506.
- Yuan, T., Liu, X., Kuo, W. (2012). Planning Simple step-stress accelerated life tests using Bayesian methods. 1. IEEE Transactions on Reliability; 61: 254-263.
- Yuan, T., Zhu, X. (2012). Reliability study of ultra-thin dielectric films with variable thickness levels. 9. IIE Transactions; 44: 744-753.
- Yuan, T., Kuo, W., Bae, S. (2011). Detection of Spatial Defect Patterns Generated in Semiconductor Fabrication Processes. IEEE Transactions on Semiconductor Manufacturing; 24: 392-403.
- Yuan, T., Ramadan, S., Bae, S. (2011). Yield Prediction for Integrated Circuits Manufacturing through Hierarchical Bayesian Modeling of Spatial Defects. IEEE Transactions on Reliability; 60: 729-741.
- Yuan, T., Bae, S., Park, J. (2010). Bayesian spatial defect pattern recognition in semiconductor fabrication using support vector clustering. International Journal of Advanced Manufacturing Technology; 51: 671-683.
- Yuan, T., Kuo, Y. (2010). Bayesian analysis of hazard rate, change point, and cost-optimal burn-in time for electronic devices. 1. IEEE Transactions on Reliability; 59: 132-138.
- Yuan, T., Kuo, W. (2008). A Model-Based Clustering Approach to the Recognition of Spatial Defect Patterns Produced During Semiconductor Fabrication. 2. Institute of Industrial Engineers Transactions; 40: 93-101.
- Yuan, T., Kuo, W. (2008). Spatial defect pattern recognition for semiconductor manufacturing using model-based clustering and Bayesian inference. European Journal of Operational Research; 190: 228-240.
- Luo, W., Yuan, T., Kuo, Y., Lu, J., Yan, J., Kuo, W. (2006). Breakdown Phenomena of Zirconium-Doped Hafnium Oxide High-k Stack with Inserted Interface Layer. 1. Applied Physics Letters; 89: 072901.
- Luo, W., Yuan, T., Kuo, Y., Lu, J., Yan, J., Kuo, W. (2006). Charge Trapping and Dielectric Relaxation in Connection wtih Breakdown of High-k Gate Dielectric Stacks. 20. Applied Physics Letters; 88: 202904.
- Yuan, T., Cizmas, P., O'Brien, T. (2005). A Reduced-Order model for a Bubbling Fluidized Bed Based on Proper Orthogonal Decomposition. Computers and Chemical Engineering; 30: 243-259.
Book, Chapter in Scholarly Book (2)
- Yuan, T., Bae, S., Kuo, Y. (2019). Defects Driven Yield and Reliability Modeling for Integrated Circuits Manufacturing. Springer; 375-393.
- Bae, S., Yuan, T. (2017). Hierarchical Bayesian Change-Point Analysis for Nonlinear Degradation Data. Statistical Modeling for Degradation Data, Springer; 21-41.
Conference Proceeding (17)
- Chen, Z., Zhu, X., Yuan, T. (2019). Working-condition importance measures for multi-component systems. Macau: IEEE International Conference on Industrial Engineering and Engineering Management.
- Almasarwah, N., Chen, Y., Suer, G., Yuan, T. (2019). Minimizing the Number of Tardy Jobs on Identical Parallel Machines Subject to Periodic Maintenance. Limerick: 29th International Conference on Flexible Automation and Intelligent Manufacturing FAIM2019.
- Yuan, T., Wang, J., Zhu, X. (2018). Age-based Preventive Maintenance for the Data Storage System of a Supercomputer. 12th International Conference on Reliability, Maintainability and Safety.
- Gao, B., Gao, Y., Kuoa, Y., Yuan, T. (2018). Plasma-based Copper Etch Process and Reliability. Seattle, WA: 233rd ECS Meeting.
- Yuan, T., Zhu, X. (2017). A Yield-Reliability Relation Modeling Approach based on Random Effects Degradation Models. Asia Pacific Conference of the Prognostics and Health Management Society.
- Fu, Y., Zhu, X., Yuan, T. (2017). Optimal Reallocation and Replacement Maintenance. 10th International Conference on Mathematical Methods in Reliability.
- Zhu, X., Cherukuri, J., Yuan, T. (2016). Failure and maintenance analysis of supercomputers. 2016 Annual Reliability and Maintainability Symposium.
- Yuan, T., Liu, X., Kuo, Y., Zhang, S. (2014). Light Wavelength Effects on Charge Trapping and Detrapping of AIOx Embedded ZrHFO High-K Stack. 2. ECS Transactions; 61: 169-175.
- Liu, X., Kuo, Y., Yuan, T. (2013). Exposure light wavelength effects on charge trapping and detrapping of nc-MoOx embedded ZrHfO high k stack. Materials Research Society Spring Meeting Proceedings; 1562.
- Liu, X., Yang, C., Kuo, Y., Yuan, T. (2012). Nanocrystalline MoOx embedded ZrHfO high-k memories - charge trapping and retention characteristics. ECS Transactions; 45.
- Yuan, T. (2011). Bayesian Planning of Optimal Step-Stress Accelerated Life test. Annual Reliability and Maintainability Symposium.
- Yuan, T. (2011). Nonparametric Bayesian Modeling of Reliability of Nanoelectronic Devices. 2011 NSF Engineering Research and Innovation Conference.
- Bae, S., Yuan, T. (2010). Reliability Prediction using Beyesian Change-Point Approaches. 4th Asia-Pacific International Symposium on Advanced Reliability and Maintenance Modeling.
- Kuo, W., Kuo, Y., Yuan, T. (2009). Reliability prediction from nonlinear degradation paths with Bayesian change-point approaches. Proceedings of 2009 NSF Engineering Research and Innovation Conference.
- Kuo, W., Kuo, Y., Yuan, T. (2008). Detecting spatial defect patterns on semiconductor wafers using model-based clustering. 2008 NSF Engineering Research and Innovation Conference.
- Yuan, T., Kuo, W. (2007). Bathtub-Shaped Hazard Rate Function for Ultra-thin Gate Dielectrics. 1. Electrochemical Society Transactions - ULSI vs. TFT Conference; 8: 243-248.
- Kuo, Y., Lu, J., Yan, J., Yuan, T. (2005). Sub 2nm Thick Zirconium Doped Hafnium Oxide High-k Gate Dielectrics. 5. Electrochemical Society Transactions on Physics and Technology of High-k Gate dielectrics III; 1: 447-454.